Vijayawada, January 15, 2025: In a significant milestone for India’s journey to becoming a global leader in chip manufacturing, Indichip Semiconductors Limited, with its joint venture partner, M/s Yitoa Micro Technology Limited (YMTL) of Japan, signed a Memorandum of Understanding (MoU) with the govt of Andhra Pradesh to establish India’s first private semiconductor manufacturing facility with an investment of over Rs 14,000 crores.
This cutting-edge facility will focus on manufacturing Silicon Carbide (SiC) chips, contributing to India’s technological advancement and sustainability goals.
The govt of Andhra Pradesh, under its Semiconductor Policy announced in November 2024, aims to transform the state into a hub for electronics and semiconductor manufacturing.
The new SiC fab facility will begin with a production capacity of 10,000 wafers per month, ramping up to 50,000 wafers per month within 2–3 years. This strategic investment aligns with India’s Aatmanirbhar Bharat vision and addresses the growing global demand for energy-efficient technologies, electric vehicles, and renewable energy solutions.
According to the reports published in timesofindia.indiatimes.com The MoU was signed between Piyush Bichhoriya, managing director of Indichip, and Saikanth Varma, CEO of APEDB, in the presence of IT minister Nara Lokesh and industries minister Sri T.G. Bharath. Indichip directors Dr. Sandeep Garg, Mr. Web Chang, and president of business strategy, Mr. Ravi AV, JV partner representatives Mr. David York Yuan Chang, chairman of Yitoa Micro Technology Corporation (YMTC), Japan, and Mr. Motosugi Keisuke, CEO of YMTC, and the project coordinator Mr. Bhaskar Reddy were also present.
Nara Lokesh, IT Minister, remarked, “This investment is a testament to Andhra Pradesh’s ability to attract cutting-edge industries through innovative policies and robust infrastructure. Our focus on nurturing talent and providing seamless support will ensure the success of this initiative and strengthen India’s global semiconductor footprint.” T.G. Bharath, industries minister, stated, “This partnership aligns with our vision of making Andhra Pradesh a manufacturing powerhouse. The establishment of this SiC fab will not only create thousands of jobs but will also spur innovation and foster ancillary industries in the region.”
Speaking on the occasion, Piyush Bichhoriya, Managing Director of Indichip Semiconductors, said, “This initiative symbolizes our commitment to nation-building through technological innovation. By focusing on Silicon Carbide chips, we aim to strengthen India’s manufacturing ecosystem and contribute to the global semiconductor industry.”
Dr. Sandeep Garg, Director at Indichip, added, “This collaboration will not only create cutting-edge technology but also pave the way for a sustainable future by addressing the growing need for energy-efficient solutions in electric vehicles and renewable energy.”
The state govt has pledged to provide the required land in Orvakal Mega Industrial Hub, Kurnool, and provide necessary infrastructure and ecosystem towards making this project successful. With this development, Andhra Pradesh is poised to emerge as a leading destination for semiconductor and electronics manufacturing, setting a benchmark for India’s growing technological process.
India’s semiconductor revolution: Andhra Pradesh signs MoU for Rs 14,000 crore
The Andhra Pradesh government has signed an MoU with Indichip Semiconductors Limited and its joint venture partner, Yitoa Micro Technology Limited (YMTL) of Japan, to establish a semiconductor manufacturing facility. With an investment exceeding Rs 14,000 crore, this Silicon Carbide (SiC) chip manufacturing facility will be India’s first private semiconductor fab.
